INTEGRATED CIRCUIT MULTICHIP MODULE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a recessed chip MCM package integrally equipped with an electromagnetic shield. SOLUTION: A surface of a cavity for housing an IC device is coated with a metal. The exposed upper surface and side surface of a multichip module(MCM) package are also metallized. A PCB(printed circuit board) for connection is provided with a solder wall, which seals a gap between an MCM tile and a PCB for connection. A solder wall is formed by using a standard solder bump technique. The seal between the MCM and PCB is formed during the same reflow operation used to flip-chip bond the MCM tile to the PCB.