| 摘要 |
PROBLEM TO BE SOLVED: To assemble an electronic device efficiently with high dimensional accuracy of sealing resin when it is assembled by mounting a chip on a substrate, and then resin sealing and burn-in of the chip. SOLUTION: A chip 2 is hot pressed onto a substrate 1 by means of a tool 3, a chip side electrode 18 is connected with a substrate side electrode 5 through bumps 4, the substrate 1 is mounted on the spotting face P.L. of upper and lower dies 20, 21, a cavity 24 formed by clamping the upper and lower dies 20, 21 is evacuated through an exhaust pipe 25 and molten resin 26 is injected into the cavity 24 and cured to form sealing resin 8. Subsequently, the substrate 1 is pressed against a test board 10 in an atmosphere of a specified temperature and the operation of an electronic device comprising a unit region 7 of the substrate 1 and the chip 2 is inspected by supplying a predetermined electric signal to the chip 2 from the test board 10 through an outer electrode 19 before the substrate 1 is cut along an imaginary line 9 to complete an electronic device. According to the method, a plurality of chips 2 can be resin sealed accurately can be burnt-in processed. |
