| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a forming method of a bump which facilitates handling, a mold to be used in the method, a semiconductor device, its manufacturing method, a circuit board and an electronic apparatus. SOLUTION: In this forming method of a bump, recessed parts 12 formed in a mold 10 are filled with paste 14 containing conductive material, an object 20 to be worked in which electrodes 22 are formed and the mold 10 are so arranged that the electrodes 22 are brought into contact with the paste 14, and the mold 10 is separated from the object 20. As a result, at least bumps 32 composed of conductive material are peeled off from the recessed parts 12 and formed on the electrodes 22.</p> |
