| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible wiring board realizing inexpensive and reliable connection between through-holes corresponding to a conductor pattern of fine pitch, while decreasing the number of production steps. SOLUTION: A conductor patter 12 is formed at a pitch of P1 or less on the main surface of a thin flexible backing material 11. A conductor pattern 13 is formed at a pitch larger than P1 on the rear surface of the backing material. A through-hole 14 is made to be surrounded by the partial regions (land region at the end part) of the conductive patterns 12, 13 and shared on the surface and rear of the backing material. In the through-hole 14, a conductive material 15 having high viscosity screen printed from the major surface side of the flexible backing material 11 and a conductive material 16 having low viscosity screen printed from the rear surface side touch each other, thus constituting a via contact structure VIA 1.
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