发明名称 GOLD CONDUCTOR PASTE AND PRODUCTION OF GLASS CERAMIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To improve the wire bonding performance, metallizing strength and appearance of a surface layer conductor formed on the surface of a glass ceramic board after fired. SOLUTION: In consideration of the existance of glass components on the surface of a glass ceramic board 11 fired in a usual firing method, a gold conductor paste used for a surface layer conductor 12 has 0-0.5 pts.wt. glass frit and 0.05-0.2 pts.wt. Rh added to. Thus, the precipitation of the glass components on the surface of the surface layer conductor 12 is restricted to assure good wire bonding performance and metallizing strength with the glass components on the surface of the board. The gold conductor paste used for the surface layer conductor of the glass ceramic board fired in a constrained firing method has 0.1-1 pts.wt. glass frit and 0.05-0.2 pts.wt. Rh added thereto, in consideration of less existing glass components on the surface of the board than those on a usually fired board.
申请公布号 JP2001135139(A) 申请公布日期 2001.05.18
申请号 JP19990310482 申请日期 1999.11.01
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC;TANAKA KIKINZOKU KOGYO KK 发明人 SHIBATA KOJI;FUKUDA JUNZO;MIYAIRI MASAYUKI;NAITO KAZUMASA
分类号 H05K3/46;H01B1/00;H01B1/22;H01L23/15;H05K1/09;(IPC1-7):H01B1/22 主分类号 H05K3/46
代理机构 代理人
主权项
地址