| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card improved in the strength and reliability of adhesion between an IC module and a card base without requiring heating in the case of adhesion. SOLUTION: Concerning this IC card, the IC module, with which an IC is packaged on a circuit board, is adhered through an adhesive layer to the card base, and this adhesive is composed of a photo setting type viscous adhesive tape containing an adhesive resin, a cationic polymerized compound and an optical cationic polymerization initiator. |
