| 摘要 |
PROBLEM TO BE SOLVED: To ensure sure bonding conditions between a metal substrate and a heating surface of a heat sink. SOLUTION: On the upper faces of a plurality of supporters 63 set up from an inner case 51, an installation flange 61 of a terminal case 55, with its rear face facing upward, for a metal substrate 57 to be mounted with electronic components is set. A heat sink 65 is set in an assembly hole 71 of an upper case 69 disposed above the inner case 51, with a heat radiating section 73 projecting above the upper case 69 and a peripheral flange 75 making contact from underneath with the periphery of an opening of the assembly hole 71. A heating surface 67 of the heat sink 65 is laid on top of the metal substrate 57. When installing the upper case 69 on the inner case 51, the heat sink 65 is pressed by the upper case 69 toward the terminal case 55 with a pressing force F1, which provides the installation flange 61 of the terminal case 55 having a deformation margin α for pressing the main body of the terminal case 55 toward the heat sink 65. |
