发明名称 METHOD FOR MAKING SUBSTRATE TO MOUNT ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a method for making a substrate to mount electronic parts that can stabilize the quality without requiring high accuracy to determine the position for a cutting-out punch. SOLUTION: A method for making a substrate 10 on which to mount electronic parts in which a plate-shaped electrode patterns material 60 is provided on the upper surface of ceramic sheet 20 comprising green sheets, the electrode pattern material 60 is divided into a pair of electrode patterns 30 and a narrow groove-shaped space 50 and a cavity 40 adjacent to the electrode patterns 30 are punched. One of the two parallel edge faces 61 and 62 of the electrode pattern material 60 is opened, an recessed section 64 expanding from the bottom toward the opening 63 is formed, and the narrow groove-shaped space 50 is formed from the bottom of the recessed section 64 to the other edge face 62 of the electrode pattern 60.
申请公布号 JP2001135740(A) 申请公布日期 2001.05.18
申请号 JP19990314718 申请日期 1999.11.05
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 ANO SEIJI
分类号 H05K3/00;H01L23/04;H01L23/12;H03H3/02;(IPC1-7):H01L23/04 主分类号 H05K3/00
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