发明名称 MANUFACTURING METHOD FOR LAMINATED CERAMIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide good quality and productivity with a high yield and small variation, by carrying out an elimination process of binder and an annealing process for a laminated green chip element effectively in a short time. SOLUTION: Base-metal inner electrode connected to an outer electrode and a barium titanate-based dielectric layer are laminated in a multi-layered state alternately to form a laminated green chip element. A laminated chip element as a sintered body is obtained from the laminated green chip element by carrying out a step of burning step for reducing the dielectric layer in an atmospheric chamber under low oxygen partial pressure after an elimination process of binder, a step for cooling the laminated green chip element, and an annealing step for oxidizing the dielectric layer in the atmospheric chamber under weak oxidizing partial pressure in a cooling temperature range. In this case, the laminated green chip elements (C) are arranged on the flat face of a carriage tray 1 one by one not overlapped with each other, and the laminated green chip elements (C) is carried to a furnace 2 by a unit of the tray 1, and treated directly to each process.
申请公布号 JP2001135546(A) 申请公布日期 2001.05.18
申请号 JP19990318452 申请日期 1999.11.09
申请人 TDK CORP 发明人 SASAKI SHINICHI;HARADA HIROSHI;SATO HIDEKI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
代理机构 代理人
主权项
地址
您可能感兴趣的专利