METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To realize conduction between common electrode pads in a semiconductor multi-chip package extremely readily via a through-hole. SOLUTION: A plurality of semiconductor chips where through-holes are formed in an electrode pad part for signal input output are laminated so that the through-holes are arranged or a straight line. A columnar conduction resin shaft for conductively connecting each electrode pad is formed by batch embedding and charging of conduction resin by pressing and supplying conduction resin from an opening of the aligned thorough-holes.