| 摘要 |
PROBLEM TO BE SOLVED: To provide an electromagnetic shield cap of an electronic part which is efficiently fixed to the electronic component at a low cost. SOLUTION: An electromagnetic shielding cap 11 is attached, for electromagnetic shield, to an infrared ray data communication module 1 comprising a solid sealing part 3 for protecting a semiconductor chip molded by a transfer mold method. Here, the contact surface to the sealing part 3 is provided with an insert part 16 which is inserted into a recessed part on the surface of sealing part formed with an eject pin at molding of the sealing part 3. |
