发明名称 TEST COUPON AND TEST METHOD FOR LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a test coupon and test method for laser beam machining capable of easily checking the power of laser beam in the manufacturing process of a wiring board to be useful for the machining with a proper degree of emission. SOLUTION: This test coupon comprising an insulating layer 1, a copper layer 2 and an insulating layer 3 from the surface layer side is used. The insulating layer 1 is formed of a resin containing no glass cloth. When laser beam is emitted to the insulating layer 1 from above, the insulating layer 1 is machined to form a hole. This hole is observed from above by a CCD camera or the like. At this time, the depth dimensional analysis is unnecessary. When the copper layer 2 is not seen as the result of observation, it can be judged that the degree of emission of laser beam is insufficient. When the area through which the copper layer 2 is seen is larger than it is estimated as the result of observation, it can be judged that the degree of emission of laser beam is excessive.</p>
申请公布号 JP2001133324(A) 申请公布日期 2001.05.18
申请号 JP19990316281 申请日期 1999.11.08
申请人 IBIDEN CO LTD 发明人 WATANABE HIROYUKI;ADACHI SHINJI
分类号 B23K26/00;B23K26/38;B23K101/42;G01J1/02;G01M11/00;G01N1/32;H05K3/00;(IPC1-7):G01J1/02 主分类号 B23K26/00
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