| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for automatically, quickly, accurately, and completely classifying the defects of a semiconductor wafer. SOLUTION: This is a method and a device for automatically classifying the defects on the surface of a semiconductor wafer into one of the prescribed number of core classes by using a core classifier using boundary and topographical information. Afterwards, the defects are classified into a low-order class of arbitrarily defined defects, and defined by a user with a specific adaptive classifier connected with one core class, and adjusted so that the defects can be classified only from a limited number of related core classes. In this case, any defect which can not be classified by the core classifier or the specific adaptive classifiers can be classified by a complete classifier.
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