发明名称 SOLDER FLUX CREEP-UP PREVENTING AGENT COMPOSITION, AND APPLICATION THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a composition for preventing creeping-up of solder flux which causes no problem on global environment and work environment, at soldering of an electronic component, printed board, etc. SOLUTION: A composition comprising an aqueous medium and polymer comprising polymerization unit of unsaturated ester comprising polyfluoroalkyl radical and polymerization unit comprising silicon and unsaturated radical. The composition further contains additional fluorine surfactant.
申请公布号 JP2001135926(A) 申请公布日期 2001.05.18
申请号 JP19990312341 申请日期 1999.11.02
申请人 SEIMI CHEM CO LTD 发明人 OTAKA TOSHIHARU;FUKATSU TAKASHI
分类号 B23K1/00;B23K35/22;B23K35/36;H05K3/28;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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