| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact mounting structure for an electronic component, where a heat-radiation efficiency is significantly improved at a low cost. SOLUTION: Related to a wiring board 1, wiring patterns 3A, 3B, and 3C, of specified pattern, are formed on the rear surface of an insulating substrate 2, and a resist layer 5 is formed on the rear surface of the insulating substrate 2 so that only those wiring patterns are exposed. Here, a connection terminal 7 of an electronic component 6 is soldered with a solder 8 sticking to the entire exposed surface of the wiring patterns 3A, 3B, and 3C, while the wiring board 1 is provided in a sealing resin 11 packed inside a jacket case 9. With this configuration, the wiring board 1 is sealed up with the sealing resin 11 in the jacket case 9 for improved heat radiation characteristics at a low cost.
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