摘要 |
PROBLEM TO BE SOLVED: To ensure electrical and mechanical connection strength of a printed wiring board and the lead for an electronic component being used. SOLUTION: A lead 1 of an electronic component having star-shaped cross-section, a lead 2 of electronic component having an H-shape cross-section, a lead 3 of electronic component having a 'cross'-shape cross-section or a lead 4 of electronic component having 'cross'-shape cross-section is employed. Electrical and mechanical strength are enhanced by enlarging the wetting area of solder.
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