发明名称 LEAD FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To ensure electrical and mechanical connection strength of a printed wiring board and the lead for an electronic component being used. SOLUTION: A lead 1 of an electronic component having star-shaped cross-section, a lead 2 of electronic component having an H-shape cross-section, a lead 3 of electronic component having a 'cross'-shape cross-section or a lead 4 of electronic component having 'cross'-shape cross-section is employed. Electrical and mechanical strength are enhanced by enlarging the wetting area of solder.
申请公布号 JP2001135905(A) 申请公布日期 2001.05.18
申请号 JP19990314010 申请日期 1999.11.04
申请人 NEC HOME ELECTRONICS LTD 发明人 NATORI KIYOBUMI
分类号 H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K1/18
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