METHOD AND APPARATUS FOR BALL TRANSFER

摘要

PROBLEM TO BE SOLVED: To transfer just required number of balls to the electrode pads of a wiring board or a semiconductor chip. SOLUTION: The apparatus for transferring balls 6 to electrode pads 71 on a substrate 7 comprises a ball arranging pallet 4 having pits 41 for arranging balls 6 formed at the positions corresponding to the electrode pads 71, a ball suction plate 3 having suction pits 31 corresponding to the arranging pits 41 formed in the ball arranging pallet 4, and a suction head base 2 connected with the ball suction plate 3 and having a suction hole 22 and an evacuation channel 23 for evacuating from the suction pits 31.