| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor package that can electrically connect, in a short distance, the connecting terminals of two or more different semiconductor packages with each other. SOLUTION: The perimeter of the package main unit 10 is made in a stepwise or down-stepwise form so that the perimeter of the package main unit 10 can be connected with the perimeter of another package main unit 10 formed stepwise or down-stepwise. The step faces 122 and 142 of the perimeter of the package main unit 10 is provided with a connecting terminal 50 that electrically connects a connecting terminal 50 formed on the step faces 122 and 142 of the perimeter of another package main unit 10. Then, the step faces 122 and 142 of the perimeter of one package main unit are closely connected with almost no gap to the faces 122 and 142 of the perimeter of the other package main unit 10 to electrically connect the connecting terminals 50 provided on the step faces 122 and 142 of the perimeters of both the package main units with each other in a short, or near zero, distance.
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