| 摘要 |
PROBLEM TO BE SOLVED: To transfer a thick film with flat surface to a large area of a substrate easily at low cost. SOLUTION: First and second plates 2 and 5 are counterposed above and below, and a wafer 3 is mounted on the downside of the first plate 2. A sheet film 6 is arranged between the first and second plates 2 and 5, and its peripheral edge is held by a film holding mechanism 31. The film holding mechanism 31 is composed of a first catching plate 36 which is slidable in the radial direction of the sheet film 6, a second catching plate 38 which is attached rotatably to this first catching plate 36, a tension coil spring 39 which gives a certain tension to the sheet film 6 so as to stretch it, by shifting the first catching plate 36 outward in the radial direction of the sheet film 6, a torsion coil spring 44 which energizes the second catching late 38 in its closing direction, and an actuator 45 which holds the second catching plate 38 usually in its open condition and releases its condition at catching of the film.
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