| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible multilayer circuit board which can prevent migration of ion which might occur in an interlayer insulating layer. SOLUTION: When desired wiring patterns 2 and 5 are formed on a plurality of layers via an interlayer insulating layer 4, layers 3, 6 and 9 of different types of metals are formed on surfaces or bottoms of the patterns 2 and 5 to prevent the occurrence of ion migration. |
