| 摘要 |
PROBLEM TO BE SOLVED: To obtain a base for an easily manufacturable semiconductor package, which allows the semiconductor package to be made compact and its heat- radiating property to be improved. SOLUTION: A first Cu plate 10 has screwing portions 12, extended from its peripheral portions and screwing holes provided therein. A Mo plate 20 and a second Cu plate 30 are stacked on the plate 10 one upon another in the stated order for avoiding the portions 12. These stacked plates 10, 20 and 30 have pressure applied thereto in the direction of their thickness and heated for joint by soldering, whereby a base is formed. The portions 12, extended from the peripheral portions of the base, are made smaller in height than the base by the sum total thickness of the plates 20 and 30. Additionally, the plates 10, 20 and 30 are jointed together intimately, without voids. |
