| 摘要 |
PROBLEM TO BE SOLVED: To prevent a connection failure due to expansion at the time of performing COG(chip-on-glass) mounting of a display device by a COG mounting system in which a monolithic semiconductor integrated circuit having a high aspect ratio is used. SOLUTION: In a display device in which the monolithic semiconductor integrated circuit and a glass substrate are connected with anisotropic conductive adhesives by performing heating and pressurization mainly from the surface opposite to the formation surface of the circuit of the semiconductor integrated circuit, the size of the electrode on a display panel is constituted to be larger than the size of a projecting electrode in the size in a direction parallel with the long side of the semiconductor integrated circuit of them and, also, the size difference between the projecting electrode and the electrode on the display panel at the vicinity of the center part of the long side of the integrated circuit is constituted to be smaller that the size difference between a projecting electrode and an electrode on the display panel at the vicinity of the diagonal part of the integrated circuit. |
