| 摘要 |
PROBLEM TO BE SOLVED: To prevent a test failure for a fine-pitched semiconductor device. SOLUTION: The semiconductor device 3 is sucked by a suction tool 9, and positioning for an electrode pad of the device 3 and an electrode pad of a test board 8 is carried out to be connected thereafter to a contactor 7 of the test board 8. The semiconductor device 3 conveyed by the tool 9 is mounted on a test socket 4 by prescribed pressurizing force for this purpose. The mounted semiconductor device 3 is temporarily fixed by a temporal fixing mechanism part constituted of a plate spring 2 and a frame 1 attached with the plate spring 2. Slippage generated easily in the device 3 is prevented from being generated by vibration during test preparation work after elevation of the suction tool 9 and by impact in a closing operation for the test socket, by providing the temporal fixing mechanism part for the device 3 in the test socket 4.
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