| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a novel method for sealing an electronic material in which an electronic material can be sealed in a short time at low cost between planar or sheet-like matters of glass, plastic, and the like. SOLUTION: In the method for sealing an electronic material 2 between planar (or sheet-like) matters 1, 1 of glass, plastic, and the like, a crosslinking sealant 3 is softened by high frequency induction heating under reduced pressure so that crosslinking reaction takes place after deairing. Heat is generated in the crosslinking sealant itself and thermal sealing takes place efficiently under reduced pressure.</p> |
