| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conducting connection body wherein paste connection material does not remain in the uncured state, in connection using the material, and excellent electric connection and mechanical fixing can be obtained over the whole connection region of a member to be connected. SOLUTION: When a substrate 1 having facing electrodes 2, 5 and a semiconductor element 4 are connected by using paste connection material 6, the material whose amount is 1.1-1.5 times Y shown by a formula (I) is spread on a region where the material is distributed in only the whole connection region (v) and a curable region (w) when the material is fluidized by thermo- compression bonding. As a result, an uncured part is not formed in the case of thermo-compression bonding. formula (I): Y = (height of electrode of one member to be connected + height of electrode of the other member to be connected)×(area of connection region). |
