| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip components mounting structure that enables reduction of package size and controls the effect of inductance element of wiring by shortening the wiring for connection with a bonding pad. SOLUTION: In this structure, a chip resistor 26 is mounted to both surfaces of a mounting substrate 50 of the structure formed by laminating, via an interlayer insulation film 40, a GND wiring 38, a signal wiring 36 and power supply wiring 34 and a heat sink (heat radiating member) 52, where a plurality of grooves (recess for accommodating chip parts) 42 for accommodating a chip resistor 26 mounted on the mounting substrate 50 are jointed to the non-IC mounting side, namely to the backside of the mounting substrate 50. |
