| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate, where a void does not occur in a solder electrode provided by reflow after a solder ball is mounted on the electrode. SOLUTION: Related to an electrode part of a substrate, the electrode part has a two-layer structure. A first layer has a function to assure adhesion to the substrate while a solid content is formed with a conductive paste comprising globular metal powder for 70-97% and inorganic filler for remaining part. A second layer has a tight film structure as well as a function for preventing air blow from the first layer at solder reflow, while a solid content is formed with a conductive paste, comprising flake-like metal powder for 80-20 wt.% and globular metal powder for a remaining part.
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