| 摘要 |
PROBLEM TO BE SOLVED: To improve work efficiency with a though-hole, while preventing a defective conduction at the through-hole by holding the through-hole with high accuracy on a resin board by laser work. SOLUTION: A work piece 30, where a conductor layer 12 is coated on both surfaces of a resin board 10, is irradiated with a laser beam on one surface side to form a through-hole 14. Here, the work piece 30 is supported by a mesh sheet 34 or a porous sheet, and the surface side of the work piece 30 opposite to the surface supported by the mesh sheet 34 or the porous sheet is irradiated with laser beam, and the through-hole 14 is formed on the work piece 30.
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