| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component which can restrain twist of wire caused by ultrasonic vibration, apply uniformly and effectively ultrasonic energy to all wiring, and obtain a uniform joint. SOLUTION: Electrodes 11 of an electronic component 10 are connected with wirings 2, 3 of a board 1 via a bump 4 by thermo-compression bonding using ultrasonic vibration together. Ultrasonic vibration is applied in parallel with the surface of the substrate in such a manner that the vibration direction makes an angle of 30-60 deg., preferably 45 deg., with the direction where the wirings 2, 3 stretch. |
