| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive paste composition, its using method and a circuit board using it, suitable for forming bump electrodes or the like and superior in coatability and anti-sag property during thermosetting. SOLUTION: This conductive paste composition contains (A) a conductive powder, (B) an epoxy group-containing polymer having units derived from compounds having an ethylenic double bond and an epoxy group in one molecule, with a weight average molecular weight within a range of 10,000 to 500,000, (C) a thermosetting resin, and (D) a solvent.</p> |
