| 摘要 |
<p>Metallic, pref. solderable layer is formed on a substrate by a process comprising (a) application of a masking layer onto the substrate; (b) removal of the mask from the parts designated for metallisation; (c) application of a soln. of a metal cpd. and a binder onto the exposed surface parts under the condition that the surface tension of the soln. is smaller than the boundary tension between the substrate and the soln. but higher than the boundary tension between the mask and the soln. the latter being higher than zero; (d) evaporation of the solvent; and (e) removal of the remaining mask without affecting the binder. Subsequently, the salt is reduced to the corresp. metal, which is fixed to the substrate by firing. The method is simple and accurate.</p> |
