| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable and high-performance thermoelement wherein the heat conductivity of a substrate is excellent for good heat efficiency while the thermal expansion factor of the substrate is similar to that of a semiconductor, causing no harmful thermal stress. SOLUTION: A plurality of substrates are provided in face each other, and the facing surfaces of the substrates are jointed to metal electrodes, respectively. A plurality of n-type semiconductors and p-type semiconductors are alternately connected through the metal electrodes. Here, the plurality of substrates comprise a carbonic substrate of carbonic material, and jointing to the substrate of the metal electrode is performed by a jointing means with electric insulating characteristics.
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