发明名称 |
METHOD AND DEVICE FOR PROCESSING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To reduce residual contaminants on the surface of a substrate by effectively drying the substrate for removal of water thereon with the air of small amount and slow speed. SOLUTION: A substrate processing device has a transfer roller 6 of the substrate 3 substantially in the horizontal direction, an air knife nozzle 3 for flowing mixed gas containing water soluble organic solvent at the concentration range of 0.05% to 90% under the substrate vapor pressure on the surface of the substrate 3 after washing transferred substantially in the horizontal direction.
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申请公布号 |
JP2001135609(A) |
申请公布日期 |
2001.05.18 |
申请号 |
JP19990311025 |
申请日期 |
1999.11.01 |
申请人 |
HITACHI LTD |
发明人 |
INAGAKI YOSHINORI;MITSUYA MUNEHISA |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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