发明名称 METHOD AND DEVICE FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To reduce residual contaminants on the surface of a substrate by effectively drying the substrate for removal of water thereon with the air of small amount and slow speed. SOLUTION: A substrate processing device has a transfer roller 6 of the substrate 3 substantially in the horizontal direction, an air knife nozzle 3 for flowing mixed gas containing water soluble organic solvent at the concentration range of 0.05% to 90% under the substrate vapor pressure on the surface of the substrate 3 after washing transferred substantially in the horizontal direction.
申请公布号 JP2001135609(A) 申请公布日期 2001.05.18
申请号 JP19990311025 申请日期 1999.11.01
申请人 HITACHI LTD 发明人 INAGAKI YOSHINORI;MITSUYA MUNEHISA
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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