| 摘要 |
PROBLEM TO BE SOLVED: To prevent an acceptable rate from decreasing and a semiconductor wafer process from becoming complex even if a chip size is increased, and to easily connect a gate pad to a gate terminal or a ground terminal. SOLUTION: In the semiconductor device, a plurality of cell blocks 12 are provided on the surface of a semiconductor substrate 2, a plurality of independent gate electrodes 8 are provided at the plurality of cell blocks 12, a plurality of gate pads 16 being connected to each of the gate electrodes 8 are provided at the semiconductor substrate 2. Marks 51a and 51b for identifying whether each of the cell blocks 12 is conforming or not are provided around each of the gate pads 16 in the semiconductor substrate 2. In this configuration, it can be easily identified whether the cell blocks 12 are conforming or not by the marks 51a and 51b. |
