发明名称 |
PRODUCTION OF METAL WIRING |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of producing an electric wiring capable of low- cost production and easily applicable to a large-sized substrate without using a vacuum film-forming device. SOLUTION: A photosensitive underlying resin film 2 is formed on an insulating substrate 1 by a coating method. Exposure and development onto the underlying resin film 2 are performed to obtain an underlying resin film 2a patterned into a wiring form. A low-resistance metal 3 of Cu is subjected to film formation on the patterned underlying resin film 2a with electroless selective plating.</p> |
申请公布号 |
JP2001135168(A) |
申请公布日期 |
2001.05.18 |
申请号 |
JP20000205190 |
申请日期 |
2000.07.06 |
申请人 |
SHARP CORP |
发明人 |
CHIKAMA YOSHIMASA;IZUMI YOSHIHIRO |
分类号 |
G02F1/136;C23C2/02;C23C18/31;C25D1/04;C25D5/02;C25D5/54;G02F1/1368;H01B13/00;H01L21/288;H01L21/3205;H01L23/52;H01L29/786;H05K3/18;H05K3/24;(IPC1-7):H01B13/00 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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