| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer prober for uniformly sucking the whole part of a silicon wafer without damaging the silicon wafer due to the position of the tester pin of a probe card. SOLUTION: A porous chuck top conductive layer 2 is formed on a pedestal constituted of a ceramic substrate 3 at which through-holes 8 for suction are formed so that a wafer prober can be constituted.
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