| 摘要 |
PROBLEM TO BE SOLVED: To form a pattern capable of measuring a film thickness of a planarizing film of an on-chip micro-lens by a thciknessmeter by a tactile probe in a part differing from an image pick-up region, and measure the film thickness in a non-breakdown inspection as an image pick-up device as a part in which the film thickness is measured differs from an image pick-up region. SOLUTION: In a solid image pick-up device having a solid image pick-up region where an on-chip micro-lens is formed, if a region 23 where a planarizing film 20 composed of a resin containing an underlayer pattern composed of the same polysilicon electrode 16, light shielding film 17, or the like as in the image pick-up region and a color layer 22 is formed; and a region 24 having no planarizing film 20 are formed except for the image pick-up region, a height of a surface of the region 24 referencing a surface of the region 23 is acquired, whereby a film thickness of the planarizing film 20 can accurately be measured.
|
