发明名称 SOLUBLE POLYIMIDE AND COMPOSITION COMPRISING THE SAME, BONDING SHEET, ADHESIVE LAMINATED FILM FOR COVERING ACCELERATOR BEAM TUBE, AND ADHESIVE LAMINATED FILM FOR COVERING CONDUCTOR WIRE FOR ACCELERATOR QUENCH HEATER
摘要 <p>A polyimide obtained by reacting an acid anhydride represented by general formula (1) with a compound represented by general formula (2). The polyimide has a solubility of 10% or higher at 20°C even in a low-boiling organic solvent, and has a glass transition temperature of 100 to 250°C and a water absorption of 1.5% or lower. (In the formula (1), X represents -(CH2)k- or a divalent organic group containing an aromatic group; and k is an integer of 1 to 10). (In the formula (2), A represents -NH2 or -NCO; Y's each independently represents -C(=O)-, -SO2-, -O-, -S-, -(CH2)m-, -NHCO-, -C(CH3)2-, -C(CF3)2-, -C(=O)O-, or a single bond; and m and n each is an integer of 0 to 10).</p>
申请公布号 WO2001034678(P1) 申请公布日期 2001.05.17
申请号 JP2000007984 申请日期 2000.11.10
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