ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

An adhesive film for a semiconductor comprising at least one resin layer comprising a resin for an adhesive film for a semiconductor which has an adhesive property such that, after adhesion with a lead frame, a 90 DEG peeling strength between the film and the lead frame is 5 N/m or more at 25 DEG C and, after sealing with a sealing agent, both of 90 DEG peeling strength values between the film and the lead frame and between the film and the sealing agent are 1000 N/m or more at least at one point of temperatures in the range of 0 to 250 DEG ; a lead frame and a semiconductor device using the adhesive film; and a method for manufacturing the semiconductor device.