| 摘要 |
<p>The present invention relates to hot melt adhesives and a method of using thereof in bookbinding at low application temperature. More specifically, the invention is directed to hot melt adhesives comprising at least one homogeneous linear or substantially linear ethylene/α-olefin interpolymer, optionally, at least one block copolymer, at least one tackifying resin, optionally, at least one plasticizer and optionally, at least one additive and/or wax.</p> |
