| 摘要 |
A unitized multilayer circuit structure (10) includes a plurality of planar dielectric insulating layers (11) stacked in laminar fashion to form a substrate. The substrate has sides formed by edges of the dielectric insulating layers (11). Recessed regions (15, 13) are formed in one or more sides of the substrate for use in attaching the unitized multilayer circuit structure (10) to a higher level assembly or for attaching electrical contact circuitry (17) to the unitized multilayer circuit structure (10). <MATH> |
