发明名称 |
VAPOR PHASE CONNECTION TECHNIQUES |
摘要 |
Electrical connections are made between a pair of elements (32, 38) disposed on opposite side of a hole (28) extending through a dielectric layer (20) by evaporating a conductive material (40) such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel. |
申请公布号 |
WO0111662(A3) |
申请公布日期 |
2001.05.17 |
申请号 |
WO2000US22227 |
申请日期 |
2000.08.11 |
申请人 |
TESSERA, INC. |
发明人 |
HABA, BELGACEM;SMITH, JOHN, W. |
分类号 |
H01L21/48;H01L21/60;H01L21/768;H01L23/12;H01L25/065;H01L25/07;H01L25/18;H05K3/40;H05K3/46;(IPC1-7):B05D5/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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