| 摘要 |
<p>Methods and apparatus are provided for the fabrication of microscale, including micron and sub-micron scale, including nanoscale, devices. Electronic transport of movable component devices is utilized through a fluidic medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force, electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone, or in conjunction with, other forces. These forces may be used singly or in combination, as well as in conjunction with yet other forces, such as fluidic forces, mechanical forces or thermal convective forces. In the preferred embodiment, devices of a size, weight and/or density which may not be effectively transported through electrophoretic transport may be transported on the surface of the target device or motherboard via electroosmotic fluid flow. Transport may be effected through the use of driving electrodes so as to transport the component device to yet other connection electrodes. In certain embodiments, the connection electrodes may also be utilized, either alone or in combination with driving electrodes, to electronically transport the component device to the connection electrodes. A driving electrode may be utilized to place the component device proximate to the connection electrodes, and then the connection electrodes be utilized to generate an electroosmotic flow so as to create a fluid pressure on the component device in a direction toward the connection electrodes. Serial movement or parallel movement of component devices may be achieved. In one aspect, the inventions contemplate methods to be practiced in a low gravity environment, such that modes of electronic transport may be utilized with component devices that could not be successfully effected in a normal gravitational environment.</p> |
