发明名称 COMPACT REFLOW AND CLEANING APPARATUS
摘要 A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.
申请公布号 WO0134335(A1) 申请公布日期 2001.05.17
申请号 WO2000US41942 申请日期 2000.11.07
申请人 SPEEDLINE TECHNOLOGIES, INC. 发明人 RICH, RANDALL, L.;DALTON, SHEAN, R.
分类号 C23G3/00;B23K1/008;B23K1/20;B23K101/42;H05K3/26;H05K3/34 主分类号 C23G3/00
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