发明名称 HEAT TREATMENT DEVICE
摘要 <p>A film forming device, comprising a treating furnace, gas feeding means feeding treating gas into the processing furnace, heating means heating the inside of the treating furnace to a specified treating temperature, and a normal pressure exhaust system for exhausting the gas inside the treating furnace at a specified exhaust pressure near the atmospheric pressure, the normal pressure exhaust system further comprising a flow-adjustable and pressure-adjustable valve, wherein the exhaust pressure of the normal pressure exhaust system is detected by a pressure sensor, and a control part controls the valve based on the pressure detected by the pressure sensor, whereby a stable control is allowed without requiring the introduction of the atmosphere or inert gas, and the structure of the exhaust system is simplified so as to reduce the cost of the entire device.</p>
申请公布号 WO2001035453(P1) 申请公布日期 2001.05.17
申请号 JP2000007886 申请日期 2000.11.09
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