发明名称 |
Planarization process |
摘要 |
In a process for planarising semiconductor substrates, a coating is removed from the surface of the substrate so that the coating remains in a trench or contact hole of the substrate with the aid of an etchant, which is applied continuously to the rotating substrate. An Independent claim is also included for an etching solution and comprising an oxidant, and a component which is capable of forming a sparingly soluble salt and/or sparingly soluble complex with oxidation products. |
申请公布号 |
EP0905754(A3) |
申请公布日期 |
2001.05.16 |
申请号 |
EP19980115931 |
申请日期 |
1998.08.24 |
申请人 |
SEZ SEMICONDUCTOR-EQUIPMENT |
发明人 |
KRUWINUS, HANS-JUERGEN, DIPL.-ING.;SELLMER, REINHARD, DIPL.-ING. |
分类号 |
C23F1/14;C23F1/18;C23F1/20;H01L21/306;H01L21/308;H01L21/3105;H01L21/311;H01L21/321;H01L21/3213 |
主分类号 |
C23F1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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