SOLDER POWDER AND METHOD FOR PREPARING THE SAME AND SOLDER PASTE
摘要
<p>An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt.% of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed. <IMAGE></p>
