发明名称 Thermocompression assembling device used to connect together a wire with an IC
摘要 <p>The conical diamond is retained in material of specific thermal expansion coefficient to ensure that it is not loosened when the temperature rises. The tool comprises a head which includes a small diamond (2) fixed to a support body (3). The diamond has a conical shape with its base retained in the support body, and its tip projecting freely. The diamond is fastened by a system which avoids the diamond becoming unseated as a result of different thermal expansion of the diamond and base material. This may comprise a seating in the block which is also conical in shape, or may comprises a welding material (5) surrounding the base of the cone, within a recess formed in the block. Materials are chosen such that their respective degrees of thermal expansion do not allow the diamond to become loose when the device is heated.</p>
申请公布号 EP1099505(A1) 申请公布日期 2001.05.16
申请号 EP20000203908 申请日期 2000.11.08
申请人 G.S. AUTOMATION SA 发明人 VAN DER MEER, MATHIJS PIETER
分类号 B23K20/02;H01L21/603;(IPC1-7):B23K20/02;B23K101/42;G01S13/75;H01Q1/46 主分类号 B23K20/02
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