| 摘要 |
<p>A multiple current path device, for carrying electric current to and conducting heat from an electronic circuit, comprising an optional heat sink (200), a plurality of conducting substrates (100, 101, 102) forming several electrically insulated current conductors, a thermally conductive, electrically insulating first layer (150), bonding each conducting substrate and the heat sink, and a plurality of electronic or electric components (120, 121) bonded to the substrates. <IMAGE></p> |
