Apparatus and method for packaging different sized semiconductor chips on a common substrate

摘要

A semiconductor package (20) has universal substrate (22) with substrate traces (28) connecting interior pads (24) with peripheral pads (26). The package may include internal package traces (30) connecting the interior (24) and peripheral (26) pads to package pins (32). The interior (24) and peripheral (26) pads are designed for configuration with semiconductor chips of different sizes (Figs. 4 to 6). The coupling of the interior (24) or peripheral (26) pads to the semiconductor chip may be by flip-chip pads (48, Fig. 4), or bonding pads (52, Fig. 5)